Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-04-15
2008-04-15
Pizarro, Marcos D. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S779000, C257S780000, C257SE23021
Reexamination Certificate
active
07358608
ABSTRACT:
The present invention provides a semiconductor device wherein a passivation film, an insulating film and an encapsulating layer are formed, in this order, on the surface of a semiconductor substrate, which is provided with a electrode pad thereon, and a leading end portion of a bump electrode supported by the insulating film and electrically connected to the electrode pad is exposed from the surface of the encapsulating layer. In the semiconductor device, a slit-shaped opening, which extends along a peripheral edge of the bottom of the bump electrode, is defined in the insulating film.
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OKI Electric Industry Co., Ltd.
Pizarro Marcos D.
Rabin & Berdo PC
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