Semiconductor device having capacitor formed in multilayer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S306000, C257S774000, C257S027000, C257S027000

Reexamination Certificate

active

10626592

ABSTRACT:
A semiconductor device having a capacitor formed in a multilayer wiring structure, the semiconductor device comprising a multilayer wiring structure including a plurality of wiring layers formed on a substrate, a capacitor arranged in a predetermined wiring layer in the multilayer wiring structure and having a lower electrode, a dielectric film, and an upper electrode, a first via formed in the predetermined wiring layer and connected to a top surface of the upper electrode of the capacitor, and a second via formed in an overlying wiring layer stacked on the predetermined wiring layer, the second via being formed on the first via.

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U.S. Appl. No. 10/626,592, filed Jul. 25, 2003, Matsunaga et al.
U.S. Appl. No. 10/793,796, filed Mar. 8, 2004, Nakashima.

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