Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-07-31
2009-10-06
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23031, C257SE23010, C257SE23052, C257SE23124, C257SE23125, C257SE23030, C257S686000, C257S777000, C257S691000, C257S666000, C257S676000, C257S528000, C257S355000, C257S357000, C257S354000, C257S668000, C257S532000
Reexamination Certificate
active
07598605
ABSTRACT:
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while permitting signal transmission between these circuits. A second capacitive insulator on the second semiconductor substrate electrically isolates the primary and secondary side circuit while permitting signal transmission therebetween. First and second frames are provided for input and output of signals to and from the primary and secondary side circuits. External electrodes of the first and second capacitive insulators are connected together by a third lead frame via a conductive adhesive body including more than one solder ball. The first and second substrates and the lead frames are sealed by a dielectric resin.
REFERENCES:
patent: 5083189 (1992-01-01), Sawaya
patent: 5245215 (1993-09-01), Sawaya
patent: 5490041 (1996-02-01), Furukawa et al.
patent: 5531002 (1996-07-01), Okada
patent: 5654984 (1997-08-01), Hershbarger et al.
patent: 5663570 (1997-09-01), Reedy et al.
patent: 6014586 (2000-01-01), Weinberg et al.
patent: 6043109 (2000-03-01), Yang et al.
patent: 6064116 (2000-05-01), Akram
patent: 6108210 (2000-08-01), Chung
patent: 6121681 (2000-09-01), Tanaka et al.
patent: 6198136 (2001-03-01), Voldman et al.
patent: 6239366 (2001-05-01), Hsuan et al.
patent: 6304243 (2001-10-01), Kondo et al.
patent: 6472747 (2002-10-01), Bazarjani et al.
patent: 6507115 (2003-01-01), Hofstee et al.
patent: 6603807 (2003-08-01), Yukutake et al.
patent: 6747341 (2004-06-01), Knapp et al.
patent: 7149088 (2006-12-01), Lin et al.
patent: 2001/0001504 (2001-05-01), Sugiyama et al.
patent: 2001/0023983 (2001-09-01), Kobayashi et al.
patent: 2002/0020915 (2002-02-01), Fujio et al.
patent: 2002/0130801 (2002-09-01), Scott et al.
patent: 2002/0192854 (2002-12-01), Tzu et al.
patent: 2003/0155645 (2003-08-01), Ito
patent: 2003/0160317 (2003-08-01), Sakamoto et al.
patent: 2003/0207501 (2003-11-01), Schoenfeld et al.
patent: 2004/0096006 (2004-05-01), Scott et al.
patent: 2004/0238934 (2004-12-01), Warner et al.
patent: 2007/0181908 (2007-08-01), Otremba
patent: 63-311748 (1988-12-01), None
patent: 5-183101 (1993-07-01), None
patent: 6-283625 (1994-10-01), None
patent: 7-307708 (1995-11-01), None
patent: 9-22960 (1997-01-01), None
patent: A-9-022960 (1997-01-01), None
patent: 3839267 (2006-08-01), None
Japanese Office Action.
U.S. Appl. No. 09/402,148, filed Mar. 30, 1998, Kojima et al.
U.S. Appl. No. 09/466,846, filed Dec. 29, 1999, Nemoto et al.
U.S. Appl. No. 09/259,058, filed Feb. 26, 1999, Yukutake et al.
Electronic Design, Tech Insights, “Two-Chip Modem Delivers Low-Cost Remote Access”, Dave Bursky, Aug. 9, 1999, pp. 39-40.
PESC '98, IEEE Power Electronics Specification Conference “Isolated Capacitively Coupled MOS Driver Circuit with Bidirectional Signal Transfer”, pp. 1208-1213, 1998.
Akiyama Noboru
Kamegaki Kazuyuki
Kojima Yasuyuki
Nemoto Minehiro
Yukutake Seigou
Antonelli, Terry Stout & Kraus, LLP.
Hitachi , Ltd.
Williams Alexander O
LandOfFree
Semiconductor device having capacitive insulation means and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having capacitive insulation means and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having capacitive insulation means and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4126275