Semiconductor device having bumps in a same row for...

Details Semiconductor device having bumps in a same row for... Semiconductor device having bumps in a same row for...

2006-07-28

2008-07-01

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257SE23069, C257SE23020, C257S786000, C257S737000, C257S775000, C257S774000, C257S773000, C257S780000, C257S782000, C257S690000, C257S691000, C257S692000, C257S693000, C257S048000, C257S778000

Reexamination Certificate

active

07394164

ABSTRACT:
A semiconductor device has a plurality of bumps in a same row for staggered probing. The bumps in a same row are disposed on a chip and include a plurality of regular bumps and a plurality of irregular bumps. The regular bumps and the irregular bumps are interspersed in a same pitch. Along a defined line, the widths of the irregular bumps are narrower than the ones of the regular bumps for fine pitch applications. Additionally, the irregular bumps have a plurality of integral probed portions far away the line, top surfaces of which are expanded such that probed points can be defined on the probed portions for staggered probing.

REFERENCES:
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patent: 6251768 (2001-06-01), Lin
patent: 7064450 (2006-06-01), Eghan et al.
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patent: 2003/0197251 (2003-10-01), Nakamura
patent: 2004/0188857 (2004-09-01), Ohnishi et al.
patent: 2006/0131726 (2006-06-01), Bruch
patent: 2006/0131993 (2006-06-01), Furuhata et al.
patent: 2007/0170601 (2007-07-01), Miyaki et al.

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