Semiconductor device having bump electrode and support area

Details Semiconductor device having bump electrode and support area Semiconductor device having bump electrode and support area

2006-01-03

2006-01-03

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C257S620000, C257S737000, C257S780000

Reexamination Certificate

active

06982496

ABSTRACT:
A semiconductor device includes a substrate, a plurality of bump electrodes disposed on the substrate, and a support area for supporting the substrate in case of carrying the substrate. The support area is disposed on a surface of the substrate, on which the bump electrode is disposed, and is disposed at a predetermined position, which is dotted on the surface of the substrate. In this device, the support area is sufficiently small, and the number of the bump electrodes can increase. Moreover, degree of freedom in a configuration of the support area increases.

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