Semiconductor device having bonding wires

Details Semiconductor device having bonding wires Semiconductor device having bonding wires

1991-10-04

1993-01-05

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257787, H01L 900

Patent

active

051775905

ABSTRACT:
In a semiconductor device, a semiconductor element is electrically connected to an inner lead portion by means of a bonding wire having almost regularly repeated concaves and convexes on its outer peripheral surface. Thus, the contact area between the bonding wire and the mold resin is increased, whereby the adhesion between the wire and resin is improved and a gap is hardly produced between the wire and resin.

REFERENCES:
patent: 3015760 (1962-01-01), Weil
patent: 3050667 (1962-08-01), Emeis
patent: 3204158 (1965-08-01), Schreiner et al.
patent: 3256471 (1966-06-01), Cowles
patent: 3416048 (1968-12-01), Spickenreuther
patent: 3484660 (1969-12-01), Rossler
patent: 3517439 (1970-06-01), Manko

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