Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Patent
1997-08-21
1999-01-26
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
257626, 257638, 257632, H01L 23544
Patent
active
058641700
ABSTRACT:
A semiconductor device in accordance with the present invention has a passivation film. The passivation film is provided on the entire surface of a substrate provided with a bonding pad and a scribe line. After applying a photoresist on the entire surface of the passivation film, a photoresist pattern is contoured. The photoresist pattern thus contoured is exposed and developed so as to be patterned. The photoresist is patterned so as to (1) provide an opening which is a connected region of a region to be the bonding pad and a region to be the scribe line, and (2) make angles of the patterning obtuse angles. Then, the passivation film is etched, and the photoresist is removed. With this arrangement, a removing solution and a resist residue do not remain in the opening section provided on a portion of the passivation film corresponding to the bonding pad, thereby preventing a quality deterioration such as corrosion of the bonding pad and breakage of wire bonding.
REFERENCES:
patent: 4364078 (1982-12-01), Smith et al.
patent: 4835592 (1989-05-01), Zommer
patent: 5237199 (1993-08-01), Morita
Conlin David G.
Sharp Kabushiki Kaisha
Thomas Tom
Vu Hung K.
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