Semiconductor device having ball grid array

Details Semiconductor device having ball grid array Semiconductor device having ball grid array

1996-09-26

1999-12-07

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257738, 257787, H01L 2348

Patent

active

059988614

ABSTRACT:
An LSI chip has first electrodes. A chip carrier has a board, second electrodes arranged on a first surface of the board, third electrodes arranged on a second surface of the board, and wires connecting second electrodes to third electrode each other. Bumps combine the first electrodes of the LSI chip with the second electrodes of the chip carrier each other. Resin fills a space between a main surface of the LSI chip and a first surface of the board, so as to fix the bumps to each other. Ball electrodes are combined with third electrodes of the chip carrier.

REFERENCES:
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patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5641990 (1997-06-01), Chiu
patent: 5654590 (1997-08-01), Kuramochi
patent: 5677575 (1997-10-01), Maeta et al.
patent: 5710695 (1998-01-01), Manteghi
Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989, p. 368.

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