Semiconductor device having ball-bonded pads

Details Semiconductor device having ball-bonded pads Semiconductor device having ball-bonded pads

1994-04-08

1996-03-05

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437211, 437214, 437215, H01L 2160

Patent

active

054967759

ABSTRACT:
An integrated circuit (IC) device comprises towers of bonded gold balls located on each bond pad. The towers allow for early encapsulation of the IC die. The IC can then be tested and attached to tab tape or a printed circuit board without particulate contamination concerns.

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patent: 5341564 (1994-08-01), Akhavain et al.
patent: 5348607 (1994-09-01), Wojnarowski
"Tape Automated bonding Standardization and Implementation Requirements (Proposal)", Jul. 1983, Solid State Products Engineering Council, 2001 Eye Street, NW, Washington D.C.
"Shindo TAB", a sales brohcure for TAB tape, Toray Marketing & Sales (America), Inc, 1875 S. Grant St Suite 720, San Mateo, CA date unknown.

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