Semiconductor device having ball-bonded pads

Details Semiconductor device having ball-bonded pads Semiconductor device having ball-bonded pads

1996-03-05

1998-10-20

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438118, H01L 2144

Patent

active

058245693

ABSTRACT:
A method for forming a semiconductor device comprises the steps of providing a semiconductor die having a plurality of pads thereon with at least one bond wire electrically coupled with one of the pads and providing a holder having a cavity therein. The die is placed in the cavity, then a layer of encapsulation is formed within the cavity to cover the die. Subsequently, the encapsulated die is removed from the cavity.

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Tape Automated bonding Standardization and Implementation Requirements (Proposal), Jul. 1983, Solid State Products Engineering Council, 2001 Eye St., NW, Washington D.C.
"Shindo TAB", a sales brochure for TAB tape, Toray Marketing & Sales (America), INC, 1875 S. Grant St., Ste. 720, San Mateo, CA.

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