Semiconductor device having an interconnecting circuit board and

Metal working – Method of mechanical manufacture – Electrical device making

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29832, H01R 4300

Patent

active

056132956

ABSTRACT:
A semiconductor device having an interconnecting circuit board includes an island formed in a predetermined plane, a semiconductor chip disposed on the island and having a plurality of electrically connecting electrode pads, an interconnecting circuit board disposed on the semiconductor chip and having an electrically conductive pattern, a plurality of inner leads disposed around the island, a first electrically connecting wire connecting the electrically conductive pattern and one of the plurality of electrically connecting electrode pads, and a second electrically connecting wire connecting the electrically conductive pattern and one of the inner leads.

REFERENCES:
patent: 4472876 (1984-09-01), Nelson
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 5010390 (1991-04-01), Tanaka
patent: 5012323 (1991-04-01), Farnworth
patent: 5150194 (1992-09-01), Brooks et al.
patent: 5220486 (1993-06-01), Takubo et al.

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