Semiconductor device having an insertable heat sink and method f

Details Semiconductor device having an insertable heat sink and method f Semiconductor device having an insertable heat sink and method f

1990-05-03

1993-06-01

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257708, 257788, 257796, 257717, H01L 2336, H01L 2338, H01L 2330

Patent

active

052162834

ABSTRACT:
A semiconductor device is disclosed having an electronic component mounted to a mounting surface opposite a heat transfer surface of a die support member. The electronic component includes a plurality of bonding pads each electrically coupled to a plurality of package leads by a number of inner leads. A package body encloses the electronic component, the inner leads, the proximal ends of the package leads and the mounting surface of the die support member. The package body includes an opening exposing a portion of the heat transfer surface of the die support member. An insertable thermally conductive heat sink extends into the opening in the package body making thermal contact with the heat transfer surface of the die support member. A thermally conductive electrically insulating adhesive joins the heat sink to the package body securing the heat sink to the package body. In the assembly process, the package body is formed prior to attachment of the heat sink. During the process of soldering the package leads of the semiconductor device to a mounting substrate, gasses within the package body can escape through the opening before excessive pressure buildup occurs within the package body.

REFERENCES:
patent: 4642716 (1987-02-01), Wakabayashi et al.
patent: 4777520 (1988-10-01), Nambu et al.
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4826741 (1989-05-01), Aldhart et al.
patent: 4866506 (1989-09-01), Nambu et al.
patent: 4890152 (1989-12-01), Hirata et al.
patent: 4918571 (1990-04-01), Grabbe

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