Semiconductor device having an inner lead extending over a centr

Details Semiconductor device having an inner lead extending over a centr Semiconductor device having an inner lead extending over a centr

1997-02-03

1998-06-02

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257686, 257723, 257696, 257698, 257693, H01L 2348, H01L 2350, H01L 2312, H01L 2302

Patent

active

057604711

ABSTRACT:
A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In the semiconductor device, the outer lead part is exposed to the outside of a side face of the plastic package, and the plastic package is mounted on any base in a standing form by the side face contacting the base.

REFERENCES:
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5440452 (1995-08-01), Kitahara

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