Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-08-02
1998-06-16
Fahmy, Wael
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257723, 257724, 257720, 257712, 257698, 257693, 257691, H01L 2507, H01L 2316, H01L 3902, H01L 2348
Patent
active
057675791
ABSTRACT:
A terminal base (N1) is electrically connected to a conductive foil pattern (201), and a terminal base (N2) is electrically connected to switching elements (T1, T2, T3). The control electrodes of the switching elements (T1, T2, T3) are electrically connected to resistors (R10, R20, R30) with wire lines (WL). Thus, by using the resistors on which the wire lines can be bonded direct, a size-reduced semiconductor device is provided.
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Arai Kiyoshi
Kanazawa Kenichi
Fahmy Wael
Mitsubishi Denki & Kabushiki Kaisha
Williams Alexander Oscar
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