Semiconductor device having an alignment mark formed by the...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Reexamination Certificate

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C257S786000, C257S737000, C257S738000, C438S014000, C438S401000, C438S460000, C438S613000, C228S180210, C228S022000, C279S009100, C451S289000, C451S388000, C118S500000, C118S730000

Reexamination Certificate

active

07112889

ABSTRACT:
A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

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Office Action from Japanese Patent Office for Application No. 11-321590 mailed Jun. 29, 2004.

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