Semiconductor device having adjacent bonding wires extending at

Details Semiconductor device having adjacent bonding wires extending at Semiconductor device having adjacent bonding wires extending at

1984-04-18

1986-10-21

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 361401, H01L 2348, H01L 2350

Patent

active

046188797

ABSTRACT:
A semiconductor device includes a semiconductor chip, a package for housing the semiconductor chip, and wires for bonding one of a plurality of electrodes formed on the semiconductor chip and one of a plurality of electrodes formed on the package. Each of the wires has a portion rising at a steep angle with respect to one of the electrodes to be bonded and a portion descending at a gentle angle with respect to the other of the electrodes to be bonded. The rising portion and the descending portion of each wire are disposed in reverse positions with respect to the rising portion and the descending portion of the adjacent wires.

REFERENCES:
patent: 3515952 (1965-02-01), Robinson
patent: 4513355 (1985-04-01), Schroeder et al.

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