Semiconductor device having adhesion increasing film to...

Details Semiconductor device having adhesion increasing film to... Semiconductor device having adhesion increasing film to...

2007-08-14

2007-08-14

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23178, C257SE21512, C257S778000, C257S753000, C257S758000, C257S774000, C257SE23065, C257SE23055, C257SE23067, C257SE23069, C257S772000, C257S779000, C257S780000, C257S668000

Reexamination Certificate

active

11143293

ABSTRACT:
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.

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patent: 2003/0189403 (2003-10-01), Yamada et al.
patent: 10-256279 (1998-09-01), None
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patent: 2003-249691 (2003-09-01), None
patent: 2003-298005 (2003-10-01), None
patent: 2004-71998 (2004-03-01), None

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