Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2011-03-22
2011-03-22
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C257SE21499, C257SE23127, C257SE23178
Reexamination Certificate
active
07910405
ABSTRACT:
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.
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Japanese Office Action dated Jul. 16, 2009 (7 pages), and English translation thereof (11 pages), issued in counterpart Japanese Application Serial No. 2004-164363.
Jobetto Hiroyasu
Okada Osamu
Casio Computer Co. Ltd.
CMK Corporation
Crawford Latanya
Holtz Holtz Goodman & Chick PC
Landau Matthew C
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