Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-02-28
2006-02-28
Lebentritt, Michael (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S787000, C257S790000, C257S795000
Reexamination Certificate
active
07005747
ABSTRACT:
A capacitor is arranged at the closest position to a semiconductor element and the generation of switching noise is reduced as low as possible by increasing the processing speed, arranging the components highly intensively and reducing the operation voltage. One face of the capacitor is connected to an electrode of the electrode forming face of the semiconductor element and the other face of the capacitor is connected to the connection pads on the wiring board so that the capacitor is interposed between the electrode forming face of the semiconductor element and the semiconductor mounting face of the wiring board, the other face of the capacitor is connected to the connection pads on the wiring board, and at the same time, flip-chip connection is conducted on the connection pads on the wiring board via the solder bumps connected to the electrodes of the semiconductor element.
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Lebentritt Michael
Shinko Electric Industries Co. Ltd.
Staas & Halsey , LLP
Stevenson Andre′
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