Semiconductor device having a trapezoidal joint chip

Details Semiconductor device having a trapezoidal joint chip Semiconductor device having a trapezoidal joint chip

1997-03-12

1999-02-09

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257774, 257778, 257724, 257725, H01L 2334

Patent

active

058698930

ABSTRACT:
A semiconductor device comprises at least two semiconductor elements connected together at a connecting region of the semiconductor elements. At least one joint chip is adhered to the connection region of the semiconductor elements for connecting the semiconductor elements together. The joint chip has a trapezoidal cross-section defining a first surface and a second surface wider than the first surface. The second surface of the joint chip is adhered to the connection region of the semiconductor elements.

REFERENCES:
patent: 3903590 (1975-09-01), Yokogawa
patent: 4578697 (1986-03-01), Takemae
patent: 4639760 (1987-01-01), Granberg et al.
patent: 5245216 (1993-09-01), Sako
patent: 5648683 (1997-07-01), Takahashi

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