Semiconductor device having a tin metallization system and packa

Details Semiconductor device having a tin metallization system and packa Semiconductor device having a tin metallization system and packa

1978-05-22

1980-02-12

Moon, Charlie T.

Metal working

Method of mechanical manufacture

Assembling or joining

29590, 228188, B01J 1700

Patent

active

041875990

ABSTRACT:
An improved metallization system for semiconductor substrates comprising successive layers of at least one barrier metal and tin is disclosed. A semiconductor package comprising a housing of impervious material, a semiconductor device having the metallization system of this invention disposed in the housing and conductor means bonded to the tin on the semiconductor device is also disclosed. The system is of particular usefulness in double stud diode packages.

REFERENCES:
patent: 2945285 (1960-07-01), Jacobs
patent: 3241931 (1966-03-01), Triggs et al.
patent: 3249470 (1966-05-01), Naake
patent: 3436614 (1969-04-01), Nagastv et al.
patent: 3447236 (1969-06-01), Hatcher
patent: 3609471 (1971-09-01), Scace
patent: 3737380 (1973-06-01), Bachmeier
patent: 3844029 (1974-10-01), Dibvgnara
patent: 3996602 (1976-12-01), Goldberg et al.

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