Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-03-21
2006-03-21
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S307700
Reexamination Certificate
active
07014731
ABSTRACT:
A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.
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Farquhar Donald S.
Papathomas Konstantinos I.
Poliks Mark D.
Aftergut Jeff H.
Goff John L.
International Business Machines - Corporation
Schmeiser Olsen & Watts
Steinberg William H.
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