Semiconductor device having a suspended isolating interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S666000, C257S686000, C257S777000, C257SE23031, C257SE23085

Reexamination Certificate

active

07902665

ABSTRACT:
A semiconductor device is configured to provide current and voltage isolation inside an integrated circuit package. The semiconductor device includes first and second semiconductor dies, a first isolating block positioned on the first semiconductor die, and a second isolating block positioned on the second semiconductor die. The semiconductor device also includes a first interconnect coil having a plurality of wires connecting the first semiconductor die to the second isolating block, and a second interconnect coil having a plurality of wires connecting the second semiconductor die to the first isolating block.

REFERENCES:
patent: 3922385 (1975-11-01), Konantz et al.
patent: 4103267 (1978-07-01), Olschewski
patent: 4780795 (1988-10-01), Meinel
patent: 5409866 (1995-04-01), Sato et al.
patent: 5763952 (1998-06-01), Lynch et al.
patent: 5861662 (1999-01-01), Candelore
patent: 5926358 (1999-07-01), Dobkin et al.
patent: 5959462 (1999-09-01), Lum
patent: 6052289 (2000-04-01), Schoenfeld et al.
patent: 6242800 (2001-06-01), Munos et al.
patent: 6369454 (2002-04-01), Chung
patent: 6380048 (2002-04-01), Boon et al.
patent: 6703692 (2004-03-01), Pruitt
patent: 6770982 (2004-08-01), Liou
patent: 6841421 (2005-01-01), Aono et al.
patent: 6847101 (2005-01-01), Fjelstad et al.
patent: 6905954 (2005-06-01), Hedler et al.
patent: 7002238 (2006-02-01), Behzad
patent: 7045831 (2006-05-01), Narazaki
patent: 7064442 (2006-06-01), Lane et al.
patent: 7075329 (2006-07-01), Chen et al.
patent: 7132314 (2006-11-01), Matsunami
patent: 7135763 (2006-11-01), Stroupe
patent: 7154165 (2006-12-01), Pruitt
patent: 7154940 (2006-12-01), Scott et al.
patent: 7447492 (2008-11-01), Dupuis
patent: 2001/0017412 (2001-08-01), Asazu et al.
patent: 2001/0040277 (2001-11-01), Lam et al.
patent: 2006/0017141 (2006-01-01), Luo et al.
patent: 2006/0276155 (2006-12-01), Feldtkeller
patent: 2007/0018338 (2007-01-01), Hosseini et al.
patent: 2007/0081280 (2007-04-01), Strzalkowski et al.
patent: 2009/0032975 (2009-02-01), Do et al.
patent: 10 2005 054 872 (2007-05-01), None
patent: 0 418 749 (1991-03-01), None
United States Office Action Issued in U.S. Appl. No. 12/003,883, mailed Nov. 12, 2009.
United States Office Action issued in U.S. Appl. No. 12/003,883, mailed Jun. 22, 2010.
International Search Report and Written Opinion of the International Searching Authority issued in International Patent Applicaiton No. PCT/US2008/088327, mailed Jun. 23, 2009.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having a suspended isolating interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a suspended isolating interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a suspended isolating interconnect will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2764980

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.