Semiconductor device having a support substrate partially...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257S187000, C257SE29246

Reexamination Certificate

active

07812372

ABSTRACT:
A semiconductor device includes a support substrate and a semiconductor layer formed on the underlying substrate. The support substrate has its metal part formed by plating and extending across its entire thickness, whilst it has the other region made of semiconductor part. In particular, the region of the support substrate lying immediately below an active region is the metal part formed by plating. The region of the support substrate lying immediately below the region other than the active region is an inactive region made of semiconductor. The semiconductor device thus suppresses warping of a substrate otherwise caused by stress in the metal part formed by plating, and heat evolved due to the current in operation of the semiconductor device may be dissipated over the shortest path through the metal part having a higher thermal conductivity.

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patent: 2003-197980 (2003-07-01), None
patent: 2004-071886 (2004-03-01), None
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P.G.M. Baltus, et al., “A 3.5-mW, 2.5-GHz Diversity Receiver and a 1.2-mW, 3.6-GHz VCO in Silicon on Anything”, IEEE Journal of Solid-State Circuits, vol. 33, No. 12 pp. 2074-2079 (1998).

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