Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-08-01
2010-12-07
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S750000, C257SE23021
Reexamination Certificate
active
07847398
ABSTRACT:
A semiconductor device has a semiconductor die having at least one bond pad formed on a first surface thereof. A substrate has at least one bond finger formed on a first surface thereof. A second surface of the semiconductor die is attached to the first surface of the substrate. A conductive wire connects the bond pad of the semiconductor die and the bond finger of the substrate wherein at least one end of the conductive wire has a stack bump. An encapsulant is provided to encapsulate the semiconductor die and the conductive wire.
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Chung Ji Young
Kim Jae Yun
Kim Yoon Joo
Na Seok Ho
Amkor Technology Inc.
Lee Eugene
Weiss & Moy P.C.
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