Semiconductor device having a semiconductor chip mounted on an i

Details Semiconductor device having a semiconductor chip mounted on an i Semiconductor device having a semiconductor chip mounted on an i

1995-06-07

1996-07-09

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, H01L 2160

Patent

active

055344640

ABSTRACT:
A method of manufacturing a semiconductor device which includes providing an insulating substrate with a semiconductor chip mounted on a first face thereof. An insulating package member which is fixed on the first face of the substrate surrounds and houses the semiconductor chip. Various manufacturing steps are described, such as molding, grinding, and machining. In one step, ultrasonic waves are used to drive a grinding head. In another step, a rotating grinding wheel is used to mill out a groove. The method is designed to reduce warpage and improve the flatness of the substrate.

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