Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-07-07
1995-09-12
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361744, 361792, 361810, 174255, H05K 702
Patent
active
054502870
ABSTRACT:
A semiconductor device which includes an insulating substrate having a semiconductor chip mounted on a first face thereof, and an insulating first package member fixed on the first face with surrounding the semiconductor chip. An insulating second package member is fixed on a second face of the substrate, which is opposite to the first face. The chip is housed in a first cavity formed by the substrate and the first package member. The first cavity is sealed by a first sealing member fixed on an opening end of the first package member. The first and second package members are respectively fixed on both sides of the substrate, so that the package is substantially or nearly symmetrical in structure in relation to the substrate. Thus, stresses in the substrate due to expansion and contraction thereof are almost or substantially balanced with each other in a firing or burning process, and as a result, warpage of the substrate is difficult to be generated and flatness of the mounting face of can be improved.
REFERENCES:
patent: 5012386 (1991-04-01), McShane et al.
NEC Corporation
Picard Leo P.
Whang Young
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