Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-02-06
2007-02-06
Toledo, Fernando L. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S110000, C257S687000, C257S690000
Reexamination Certificate
active
10762451
ABSTRACT:
An efficient fabrication method of a SON type semiconductor device is to be provided. A plurality of linear leadframes is arranged side by side separately from each other. A plurality of semiconductor chips with a plurality of electrode pads is mounted over the plurality of the linear leadframes separately. The plurality of the electrode pads is joined to the plurality of linear leadframes with bonding wires. An encapsulation part for encapsulating the semiconductor chip and the bonding wires and an interframe encapsulation part for filling a space between the linear leadframes exposed outside the encapsulation part are formed. A groove part for cutting all the linear leadframes placed right under the semiconductor chip in the orthogonal direction with respect to the direction of extension of the linear leadframes is formed. The leadframes and the interframe encapsulation parts exposed between the plurality of semiconductor chips are cut to be separated into a semiconductor device.
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Oki Electic Industry Co., Ltd.
Toledo Fernando L.
Wenderoth , Lind & Ponack, L.L.P.
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