Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent
1993-08-24
1995-08-22
Munson, Gene M.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
257722, H01L 2336
Patent
active
054443040
ABSTRACT:
A semiconductor device constituted by a VSMP (Vertical Surface Mount Package) is provided in which a thickness of a plastic package encapsulating a semiconductor chip is very small, wherein even when a semiconductor chip having large power consumption is contained therein, the effect of heat radiation can be effectively improved. A VSMP constituting the semiconductor device, which is mounted perpendicularly on a surface of a substrate, includes: external connection terminals for supplying I/O signals from peripheral circuits and electric power to the semiconductor chip; supporting terminals for holding the VSMP in a perpendicularly-mounted state; a plastic package for protecting the internal elements; and radiating fins with an irregular configuration provided on both sides of the plastic package. The radiating fins having the irregular configuration are formed so as to extend in a direction of a length of the semiconductor device and are formed on both the front side and the rear side of the plastic package.
REFERENCES:
patent: 5155579 (1992-10-01), AuYeung
patent: 5194935 (1993-03-01), Kitano et al.
patent: 5296740 (1994-03-01), Sono et al.
Hara Kouji
Tanabe Jun
Hitachi , Ltd.
Munson Gene M.
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