Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-01-04
2005-01-04
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S111000
Reexamination Certificate
active
06838312
ABSTRACT:
A semiconductor device having a plurality of semiconductor chips respectively joined to predetermined positions on a surface of a solid, and a frame holding the plurality of semiconductor chips in a relative positional relationship corresponding to joint positions on the surface of the solid. The solid may be another semiconductor chip or a wiring board. The plurality of semiconductor chips may be bonded to a surface, opposite to the surface, of the solid, of the frame. The plurality of semiconductor chips may be respectively fitted in through holes formed in the frame.
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Hikita Junichi
Yamamoto Koji
Rabin & Berdo P.C.
ROHM Co. Ltd.
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