Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-06-20
2006-06-20
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S786000
Reexamination Certificate
active
07064443
ABSTRACT:
A semiconductor chip includes a semiconductor substrate, terminals of A (A is an integer equal to or larger than two groups that are included in each of groups, and an integrated circuit. A plurality of terminals in each of the groups are arranged in accordance with predetermined basic terminal arrangement. Each of the A groups is disposed at each of positions that are defined by rotating one of the positions around a point. Each of the groups includes same-function terminals Vdd (Vss, OE, and WE) to achieve the same function at the same positions of the basic terminal arrangement to enable the same semiconductor chips to be stacked.
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patent: 03-181163 (1991-08-01), None
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patent: A 2001-053243 (2001-02-01), None
patent: 2002-050735 (2002-02-01), None
patent: 2003-060053 (2003-02-01), None
Pizarro-Crespo Marcos D.
Weiss Howard
LandOfFree
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