Semiconductor device having a plurality of semiconductor chips

Details Semiconductor device having a plurality of semiconductor chips Semiconductor device having a plurality of semiconductor chips

1994-03-17

1995-11-28

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 257778, 257787, 257686, 361735, H05K 502, H01L 2328

Patent

active

054713692

ABSTRACT:
A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At least two lead frames are provided in and extend from the package so that the first semiconductor chip and the second semiconductor chip can be electrically connected to external devices. A die stage is provided between the first semiconductor chip and the second semiconductor chip. A bonding wire is provided for wiring between the first semiconductor chip and the lead frames, and TAB leads connect the second semiconductor chip to the lead frames. The lead frames may extend between the first and second semiconductor devices instead of the die stage. The lead frames may include one having a portion extending in a direction perpendicular to the longitudinal direction of the lead frames between the first and second semiconductor chips.

Affiliated with

Also associated with

Rating

Semiconductor device having a plurality of semiconductor chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a plurality of semiconductor chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a plurality of semiconductor chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2017730