Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1994-12-14
1996-04-16
Wojciechowicz, Edward
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257672, 257680, 257723, 257773, 257787, H01L 2348
Patent
active
055085652
ABSTRACT:
A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to that of the first chip, and a plurality of second terminals formed on a main surface of the second chip and substantially arranged into a line. The first and second chips are arranged in a predetermined direction perpendicular to the main surfaces of the first and second chips. The semiconductor device also includes a plurality of connecting members connected to the first terminals and the second terminals and provided for external connections.
REFERENCES:
patent: 4956694 (1990-09-01), Eide
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 5233220 (1993-08-01), Lamson et al.
European Search Report dated Jun. 1, 1993.
WO 91/14282, Sep. 19, 1991, PCT International Publication.
Baba Fumio
Hatakeyama Atsushi
Kasai Junichi
Sato Mitsutaka
Fujitsu Limited
Wojciechowicz Edward
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