Semiconductor device having a plurality of chips

Details Semiconductor device having a plurality of chips Semiconductor device having a plurality of chips

1992-10-16

1996-06-25

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257777, 257790, 257793, H01L 2302, H01L 2504

Patent

active

055302920

ABSTRACT:
Two semiconductor chips are coupled to outer leads by means of tape leads so that the chips are spaced apart from each other. A space between the chips is filled with a mold resin.

REFERENCES:
Patent Abstracts of Japan, vol. 012, No. 207 (E-621), Jun. 14, 1988 (JP 63-4636).
Patent Abstracts of Japan, vol. 014, No. 564 (E-101), Dec. 14, 1990 (JP 2-246128).
Patent Abstracts of Japan, vol. 013, No. 470 (E-835), Oct. 24, 1989 (JP 1-184860).
Patent Abstracts of Japan, vol. 014, No. 082 (E-0889), Feb. 15, 1990 (JP 1-293556).
Patent Abstracts of Japan, vol. 006, No. 016 (E-092), Jan. 29, 1982 (JP 56-137665).
Patent Abstracts of Japan, vol. 013, No. 298 (E-784), Jul. 10, 1989 (JP 1-77136).
"Stacked Tab Chip Carrier", IBM Technical Disclosure Bulletin, vol. 33, No. 6A, Nov. 1990, Armonk, NY, US.
Patent Abstracts of Japan, vol. 12, No. 225 (E-626), Jun. 25, 1988 and JP A-63-18654 (Hitachi Micro Comput. Engl Ltd) Jan. 26, 1988.
Patent Abstracts of Japan, vol. 13, No. 298 (E-784), Jul. 10, 1989 (JP A-1-77135).
Patent Abstracts of Japan, vol. 13, No. 483 (E-839), Nov. 2, 1989 (JP A-1-191462).
Patent Abstracts of Japan, vol. 14, No. 99 (E-089), Feb. 22, 1990 (JP A-1-303730).

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