Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-02-15
2009-12-01
Garber, Charles D. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
Reexamination Certificate
active
07625781
ABSTRACT:
A semiconductor device having a plastic housing and external connections, and to a method for producing the same is disclosed. In one embodiment, the plastic housing has a housing external contour made of plastic external areas with a top side, an underside opposite to the top side, and edge sides. Lower external contact areas are arranged on the underside and upper external contact areas are arranged on the top side. Furthermore, the plastic housing has external conductor tracks along the housing external contour, by means of which the lower and upper external contact areas are electrically connected. For this purpose, the external conductor tracks have at least one jet-printed first conductor track layer made of electrically conductive material. Such jet-printed conductor track layers may also be applied to active top sides of semiconductor chips in order to bridge underlying conductor track layers.
REFERENCES:
patent: 5734270 (1998-03-01), Buchanan
patent: 6013948 (2000-01-01), Akram et al.
patent: 6093584 (2000-07-01), Fjelstad
patent: 6177721 (2001-01-01), Suh et al.
patent: 6355507 (2002-03-01), Fanworth
patent: 6618267 (2003-09-01), Dalal et al.
patent: 6821819 (2004-11-01), Benavides et al.
patent: 2003/0030143 (2003-02-01), Wennemuth et al.
patent: 2003/0151144 (2003-08-01), Muta et al.
patent: 2004/0173892 (2004-09-01), Nakanishi
patent: 2004/0183185 (2004-09-01), Badihi
patent: 3326508 (1985-02-01), None
patent: 10137346 (2003-02-01), None
patent: 10138278 (2003-04-01), None
patent: 102004009056 (2005-09-01), None
patent: 04206858 (1992-07-01), None
patent: 2001009831 (2001-02-01), None
patent: 2001018381 (2001-03-01), None
patent: 2005/081316 (2005-09-01), None
Dicke Billig & Czaja, PLLC
Garber Charles D.
Infineon - Technologies AG
Stevenson André C
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