Semiconductor device having a particular shaped die pad and coat

Details Semiconductor device having a particular shaped die pad and coat Semiconductor device having a particular shaped die pad and coat

1992-02-07

1993-01-26

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257676, H01L 2328, H01L 2330, H01L 2312

Patent

active

051826305

ABSTRACT:
A semiconductor device is provided with: a semiconductor element having a mounting face; a lead frame including a die pad having an upper surface on which the semiconductor element is mounted with the mounting face facing to the upper surface of the die pad. The die pad has such an outer shape that a central portion of each sides opposed to each other is caved more inward than an outer shape of the mounting face of the semiconductor element. The semiconductor device is also provided with: a resin film coated on a lower surface of the die pad, and a portion of the mounting face of the semiconductor element, exposed at the central portion of each side of the die pad which is opposed to each other; and a package body made of molding compound for encapsulating the semiconductor element, the die pad and the resin film. The resin film is made of resin having a high adhesiveness with respect to the semiconductor element, the die pad and the molding compound of the package body.

REFERENCES:
patent: 4942452 (1990-07-01), Kitano et al.

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