Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent
1997-10-31
1999-06-01
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
257737, 257738, 257774, 257693, 257795, H01L 2302, H01L 2348, H01L 2334, H01L 2328
Patent
active
059090545
ABSTRACT:
A semiconductor device comprises a multiple-terminal integrated circuit formed on a substrate. The integrated circuit is formed on the upper surface of the substrate and electrically connected to a plurality of external terminals arranged on an under surface of the substrate. Part of a sealing member is embedded in a plurality of through-holes. The through holes are provided in the substrate to be in the vicinity of the plurality of external terminals. The sealing member seals the upper surface of the substrate, with the integrated circuit formed thereon.
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Kabushiki Kaisha Toshiba
Williams Alexander Oscar
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