Semiconductor device having a multilayer interconnection...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S774000, C257S767000, C257S761000, C257S762000, C257S763000

Reexamination Certificate

active

07145241

ABSTRACT:
A multilayer interconnection structure includes a first interconnection layer having a copper interconnection pattern and a second interconnection layer having an aluminum interconnection layer and formed on the first interconnection layer via an intervening interlayer insulation film, wherein a tungsten plug is formed in a via-hole formed in the interlayer insulation film so as to connect the first interconnection layer and the second interconnection layer electrically. The via-hole has a depth/diameter ratio of 1.25 or more, and there is formed a conductive nitride film between the outer wall of the tungsten plug and an inner wall of the via-hole such that the entirety of the conductive nitride film is formed of a conductive nitride.

REFERENCES:
patent: 6037664 (2000-03-01), Zhao et al.
patent: 6306732 (2001-10-01), Brown
patent: 6359328 (2002-03-01), Dubin
patent: 6372633 (2002-04-01), Maydan et al.
patent: 6500675 (2002-12-01), Takata et al.
patent: 1131817 (1996-09-01), None
patent: 1359536 (2002-07-01), None
patent: 0724292 (1996-07-01), None
patent: 06-287741 (1994-11-01), None
patent: 7-94610 (1995-04-01), None
patent: 11-8753 (1999-01-01), None
patent: 2001-93976 (2001-04-01), None

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