Semiconductor device having a mount board

Details Semiconductor device having a mount board Semiconductor device having a mount board

2007-11-14

2011-12-06

Im, Junghwa M (Department: 2811)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S252000, C174S250000, C257S701000, C257S722000, C257S713000, C257S685000, C257S712000

Reexamination Certificate

active

08071894

ABSTRACT:
A semiconductor device includes a module board mounting thereon an electric component and including a plug at an edge of the module board, and a mount board including thereon a socket adapted to said plug on a surface portion of the mount board for mounting thereon the module board via said plug, wherein the mount board includes therein a heat radiation layer in contact with a bottom surface of the socket, wherein the socket comprises a heat radiation guide plate in contact with a side surface of the socket.

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Japanese Office Action dated Mar. 21, 2008 with Partial English Translation.

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