Semiconductor device having a metallic fuse member and cutting m

Details Semiconductor device having a metallic fuse member and cutting m Semiconductor device having a metallic fuse member and cutting m

1998-05-04

2000-12-19

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257530, 257209, 438281, H01L 2900

Patent

active

061630624

ABSTRACT:
A semiconductor device has a plurality of fuse members (1a, 1b) composed of a metal that can be cut by laser light (4), disposed over a semiconductor substrate (5). The length L of the fuse members (1a, 1b) is smaller than a value obtained by subtracting an alignment error .alpha. of the laser light (4) from a spot diameter D of the laser light (4), i.e., the value (D-.alpha.). The fuse members (1a, 1b) are spaced a distance l larger than a value obtained by adding the alignment error .alpha. to the half of the spot diameter D, i.e., the value (D/2+.alpha.).

REFERENCES:
patent: 5374590 (1994-12-01), Batdorf et al.
patent: 5444012 (1995-08-01), Yoshizumi et al.
patent: 5608257 (1997-03-01), Lee et al.
patent: 5760674 (1998-06-01), Gilmour et al.
patent: 5851903 (1998-12-01), Stamper
patent: 5872389 (1999-02-01), Nishimura et al.
patent: 5879966 (1999-03-01), Lee et al.

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