Semiconductor device having a mechanical buffer

Details Semiconductor device having a mechanical buffer Semiconductor device having a mechanical buffer

1989-03-13

1993-08-10

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257781, 257784, 257786, H01L 2348, H01L 2934

Patent

active

052352129

ABSTRACT:
A metal having a Knoop hardness of 40 or more is used as an electrode, Cu or a Cu alloy is used as a thin metal wire, and a mechanical buffer layer is formed between the electrode and an insulating material layer. Silicon nitride or metal vanadium is used as the mechanical buffer layer. The thin metal wire is fixed to the electrode metal by compression bonding.

REFERENCES:
patent: 4067099 (1978-01-01), Ito et al.
patent: 4556897 (1985-12-01), Yorikane et al.
patent: 4613888 (1986-09-01), Mase et al.
patent: 4622576 (1986-11-01), Bynoski
patent: 4733289 (1988-03-01), Tsurumaru
patent: 4800176 (1989-01-01), Kakumu et al.
patent: 4841354 (1989-06-01), Inaba
patent: 4845543 (1989-07-01), Okikawa et al.
patent: 4897709 (1990-01-01), Yokoyama et al.
Benjamin, "high current internal contact structure for integrated circuits", IBM TDB, vol. 19, No. 10, Mar. 1977, p. 3732.
English Translation of Published Unexamined Japanese Patent Application (PUJPA) No. 60-45048 for Inoue.
English Translation of Published Unexamined Japanese Patent Application (PUJPA) No. 62-32636 for Kondo.
English Translation of Japanese Patent Document No. 57-45343 to M. Takagi.

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