Semiconductor device having a laser printable envelope

Details Semiconductor device having a laser printable envelope Semiconductor device having a laser printable envelope

1986-04-14

1990-10-23

Hille, Rolf

357 74, 357 68, H01L 2328, H01L 2330

Patent

active

049656422

ABSTRACT:
Laser printing is used to print information relating to, for example, device characteristics on the envelope of a semiconductor device. Where that envelope is of plastics material of sufficiently high purity to be acceptable as an encapsulation, the contrast of the laser printed areas can be low when compared with the unprinted areas. In a laser printable envelope in accordance with the invention an insert (5) is introduced into a plastics encapsulation (2) and the surface (7) of the insert provides a surface for the envelope which is capable of receiving laser printing at high contrast in comparison to the external surface of the encapsulation. The insert is separated from the semiconductor element 10 and connecting wires 11 by a part 12 of the encapsulation. The insert may be of laminated structure, for example Formica (Trade Mark).

REFERENCES:
patent: 4337182 (1982-06-01), Needham
patent: 4560580 (1985-12-01), Needham et al.
patent: 4654225 (1987-03-01), Needham et al.

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