Semiconductor device having a highly air-tight package

Details Semiconductor device having a highly air-tight package Semiconductor device having a highly air-tight package

1978-01-10

1979-10-23

James, Andrew J.

Wave transmission lines and networks

Automatically controlled systems

With control of equalizer and/or delay network

357 74, 357 80, 333246, 333247, H01L 2302, H01L 3902, H01L 2312

Patent

active

041722612

ABSTRACT:
A semiconductor device is provided with a metal header of a size sufficiently small such that only a semiconductor element holding plate which requires heat dissipation can be mounted thereon. The metal header supports at its upper fringe portion an apertured member having a penetrating opening sealed along the opening. An insulative outer frame having a thermal expansion coefficient of the same order as that of the apertured member is supported on the peripheral portion of the apertured member. A lid member for hermetic sealing is bonded onto the outer frame.

REFERENCES:
patent: 3936864 (1976-02-01), Benjamin
patent: 3946428 (1976-03-01), Anazawa et al.
patent: 4042952 (1977-08-01), Kraybill

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