Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-03-01
2010-02-23
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S693000, C257S698000, C257S725000, C257SE23169
Reexamination Certificate
active
07667315
ABSTRACT:
A semiconductor chip includes a semiconductor substrate having an opening portion and a frame portion defining a periphery of the opening portion. At least one electric element is provided on the frame portion, and has at least one electrode terminal. A first insulation film is formed on the frame portion so that the electrode terminal is partially exposed at the first insulation film to form a plurality of electrode pads.
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Monbleau Davienne
Oki Semiconductor Co., Ltd.
Rabin & Berdo PC
Roland Christopher M
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