Semiconductor device having a compressed device isolation...

Details Semiconductor device having a compressed device isolation... Semiconductor device having a compressed device isolation...

2006-12-29

2009-06-02

Richards, N Drew (Department: 2822)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Grooved and refilled with deposited dielectric material

C438S221000, C438S424000, C438S435000, C257SE21002

Reexamination Certificate

active

07541259

ABSTRACT:
The semiconductor device includes a lower device isolation structure formed in a semiconductor substrate to define an active region. The lower device isolation structure has a first compressive stress. An upper device isolation structure is disposed over the lower device isolation structure. The upper device isolation structure has a second compressive stress greater than the first compressive stress. A gate structure is disposed over the active region between the neighboring upper device isolation structures.

REFERENCES:
patent: 6717216 (2004-04-01), Doris et al.
patent: 7256081 (2007-08-01), Yang et al.
patent: 7301205 (2007-11-01), Matsumori
patent: 7381609 (2008-06-01), Yang et al.
patent: 2005/0233540 (2005-10-01), Yoon et al.
patent: 2006/0121688 (2006-06-01), Ko et al.
patent: 2006/0220142 (2006-10-01), Tamura
patent: 1019970008482 (1997-05-01), None
patent: 1998-084173 (1998-12-01), None
patent: 1020060000483 (2006-01-01), None
patent: WO 98/43293 (1998-10-01), None

Affiliated with

Also associated with

Rating

Semiconductor device having a compressed device isolation... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a compressed device isolation..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a compressed device isolation... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4135696