Semiconductor device having a channel region including a vacancy

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Non-single crystal – or recrystallized – material with...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257 66, 257335, 257617, H01L 2904, H01L 31036

Patent

active

058474110

ABSTRACT:
A first polysilicon layer is formed on a substrate, and vacancies are introduced into an upper portion of the first polysilicon layer, thereby forming a second polysilicon layer. Then, a third polysilicon layer is formed on the second polysilicon layer. After depositing a silicon oxide film and a polysilicon film for a gate on the third polysilicon layer, these films are made into a pattern, thereby forming a control gate electrode and a gate oxide film. Impurity ions are then implanted, thereby forming source/drain regions. Thus, a channel region including the second polysilicon layer with the vacancies introduced is disposed below the control gate electrode, and hence, the mobility of a carrier in the channel region can be improved. As a result, a device can be operated at a high speed with a low voltage.

REFERENCES:
patent: 5481128 (1996-01-01), Hong
patent: 5548132 (1996-08-01), Batra et al.
patent: 5583366 (1996-12-01), Nakazawa
patent: 5665981 (1997-09-01), Banerjee et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having a channel region including a vacancy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a channel region including a vacancy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a channel region including a vacancy will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-180569

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.