Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1996-02-21
1998-10-27
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257737, 257739, 257778, 257779, 257780, 438108, 438613, H01L 2348, H01L 2352, H01L 2940
Patent
active
058281282
ABSTRACT:
A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.
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patent: 5376584 (1994-12-01), Agarwala
patent: 5461261 (1995-10-01), Nishiguchi
patent: 5465152 (1995-11-01), Bilodeau et al.
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patent: 5600180 (1997-02-01), Kusaka et al.
Higashiguchi Yutaka
Ichihara Yasuhiro
Igarashi Shuzo
Kobayashi Yasushi
Kumai Toshio
Fujitsu Ltd.
Jackson Jerome
Wilson Allan R.
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