Semiconductor device having a buffer structure for eliminating d

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357 4, 357 89, 357 90, H01L 29161, H01L 2712

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active

051344467

ABSTRACT:
A semiconductor service having a group III-V compound semiconductor layer formed on a buffer structure for intercepting propagation of defects, in which the buffer structure comprises a first material layer of a group III-V compound semiconductor material, a second material layer of a group III-V compound semiconductor material provided on the first material layer, the second material layer containing a first group III element and a second group III element different from the first group III element with a graded compositional profile in which the content of the second group III element is decreased towards an upper boundary and a lower boundary of the second material layer.

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Journal of Vacuum Science & Technology/Section B, vol. 5, No. 4, Jul./Aug. 1987, pp. 1156-1161, Second Series, Woodbury, NY USA; J. S. Ahearn et al.: "Control of dislocations in GaAs grown on Si(211) by molecular beam epitaxy" p. 1156; FIGS. 1, 8, 10.
Applied Physics Letters, vol. 52, No. 8, Feb. 22, 1988, pp. 651-653, New York, NY, USA; R. J. Malik et al.: "Electron beam source molecular beam epitaxial growth of analog graded AlxGa1-xAs ballistic transistors" p. 652; FIG. 3.
Applied Physics Letters, vol. 50, No. 6, Feb. 9, 1987, pp. 301-303, New York, NY, USA; M. E. Givens et al.: "Effect of compositionally graded and superlattice buffer layers on the devie performance of graded barrier quantum well heterostructure laser diodes" pp. 301-303.
Research Disclosure, No. 270, Oct. 1986, p. 627, New York, NY, USA; "Intermetallic Semiconductor Buffered Substrate".
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