Patent
1991-07-01
1992-07-28
James, Andrew J.
357 4, 357 89, 357 90, H01L 29161, H01L 2712
Patent
active
051344467
ABSTRACT:
A semiconductor service having a group III-V compound semiconductor layer formed on a buffer structure for intercepting propagation of defects, in which the buffer structure comprises a first material layer of a group III-V compound semiconductor material, a second material layer of a group III-V compound semiconductor material provided on the first material layer, the second material layer containing a first group III element and a second group III element different from the first group III element with a graded compositional profile in which the content of the second group III element is decreased towards an upper boundary and a lower boundary of the second material layer.
REFERENCES:
patent: 3821033 (1974-06-01), Hu
patent: 4568958 (1986-02-01), Baliga
patent: 4719155 (1988-01-01), Matsumoto
patent: 4768074 (1988-08-01), Yoshida et al.
patent: 4769341 (1988-09-01), Luryi
patent: 4806996 (1989-02-01), Luryi
patent: 4872046 (1989-10-01), Morkoc et al.
Journal of Vacuum Science & Technology/Section B, vol. 5, No. 4, Jul./Aug. 1987, pp. 1156-1161, Second Series, Woodbury, NY USA; J. S. Ahearn et al.: "Control of dislocations in GaAs grown on Si(211) by molecular beam epitaxy" p. 1156; FIGS. 1, 8, 10.
Applied Physics Letters, vol. 52, No. 8, Feb. 22, 1988, pp. 651-653, New York, NY, USA; R. J. Malik et al.: "Electron beam source molecular beam epitaxial growth of analog graded AlxGa1-xAs ballistic transistors" p. 652; FIG. 3.
Applied Physics Letters, vol. 50, No. 6, Feb. 9, 1987, pp. 301-303, New York, NY, USA; M. E. Givens et al.: "Effect of compositionally graded and superlattice buffer layers on the devie performance of graded barrier quantum well heterostructure laser diodes" pp. 301-303.
Research Disclosure, No. 270, Oct. 1986, p. 627, New York, NY, USA; "Intermetallic Semiconductor Buffered Substrate".
Patent Abstracts of Japan, vol. 12, No. 449 (E-686), Nov. 25, 1988; and JP-A-63 117 487 (Furukawa Electric Co. Ltd.) Jul. 21, 1988.
Patent Abstracts of Japan, vol. 12, No. 425 (E-681), Nov. 10, 1988; and JP-A-63 164 476 (Fujitsu Ltd.) Jul. 7, 1988.
Fujitsu Limited
James Andrew J.
Ngo Ngan Van
LandOfFree
Semiconductor device having a buffer structure for eliminating d does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having a buffer structure for eliminating d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a buffer structure for eliminating d will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1689750