Semiconductor device having a bonding wire and method for...

Details Semiconductor device having a bonding wire and method for... Semiconductor device having a bonding wire and method for...

2007-08-08

2009-08-04

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23085, C257SE23141, C257SE25013, C257SE23114, C257SE23021, C257SE23172, C257SE25023, C257SE25030, C257S777000, C257S723000, C257S678000, C257S784000, C257S786000, C257S725000, C257S778000

Reexamination Certificate

active

07569922

ABSTRACT:
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic shielding plate inserted between the first semiconductor chip and the second semiconductor chip; and a bonding wire bonded on the substrate so as to be astride of the electromagnetic shielding plate.

REFERENCES:
patent: 7217993 (2007-05-01), Nishimura
patent: 7354800 (2008-04-01), Carson
patent: 7364946 (2008-04-01), Karnezos
patent: 2004/0051170 (2004-03-01), Kawakami et al.
patent: 2006/0102992 (2006-05-01), Kwon et al.
patent: 3681690 (2003-08-01), None
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patent: 2005-026639 (2005-01-01), None
patent: 2005-129847 (2005-05-01), None
patent: 2006-060128 (2006-03-01), None
patent: 2006-173434 (2006-06-01), None
patent: 2006-173435 (2006-06-01), None

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