Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2011-01-04
2011-01-04
Graybill, David E (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S503000, C257S734000, C257S739000, C257S758000, C257S759000, C257S760000, C257S773000, C257S774000, C257S779000, C257S784000, C257S786000
Reexamination Certificate
active
07863705
ABSTRACT:
A bonding pad structure in a semiconductor device includes a contact pad connected to an interconnect, a bonding pad overlying the contact pad with an intervention of an insulating film and exposed from an opening of a passivation film, and an annular contact disposed between the contact pad and the bonding pad for electric connection therebetween. The annular contact encircles the opening as viewed normal to the substrate surface.
REFERENCES:
patent: 5248903 (1993-09-01), Heim
patent: 5502337 (1996-03-01), Nozaki
patent: 5736791 (1998-04-01), Fujiki et al.
patent: 5739587 (1998-04-01), Sato
patent: 5986343 (1999-11-01), Chittipeddi et al.
patent: 5986346 (1999-11-01), Katoh
patent: 6028367 (2000-02-01), Yu
patent: 6100589 (2000-08-01), Tanaka
patent: 6222270 (2001-04-01), Lee
patent: 6313537 (2001-11-01), Lee et al.
patent: 6313540 (2001-11-01), Kida et al.
patent: 6353262 (2002-03-01), Honda
patent: 6372409 (2002-04-01), Yu
patent: 6448641 (2002-09-01), Ker et al.
patent: 6448650 (2002-09-01), Saran et al.
patent: 6465337 (2002-10-01), Lee et al.
patent: 6489228 (2002-12-01), Vigna et al.
patent: 6522021 (2003-02-01), Sakihama et al.
patent: 6551916 (2003-04-01), Lin et al.
patent: 6552438 (2003-04-01), Lee et al.
patent: 6566752 (2003-05-01), Hsia et al.
patent: 6756675 (2004-06-01), Tanaka
patent: 6787928 (2004-09-01), Lin
patent: 6803302 (2004-10-01), Pozder et al.
patent: 6818540 (2004-11-01), Saran et al.
patent: 6822329 (2004-11-01), Varrot et al.
patent: 6828681 (2004-12-01), Furuhata
patent: 6875682 (2005-04-01), Liu et al.
patent: 6908841 (2005-06-01), Burrell et al.
patent: 6909196 (2005-06-01), Batra et al.
patent: 6921714 (2005-07-01), Yamaha
patent: 6927498 (2005-08-01), Huang et al.
patent: 6955981 (2005-10-01), Lee et al.
patent: 7081679 (2006-07-01), Huang et al.
patent: 7135395 (2006-11-01), Liu et al.
patent: 7148574 (2006-12-01), Lee et al.
patent: 7160795 (2007-01-01), Batra et al.
patent: 7169694 (2007-01-01), Pozder et al.
patent: 7199042 (2007-04-01), Ozawa
patent: 7202565 (2007-04-01), Matsuura et al.
patent: 7242102 (2007-07-01), Kang et al.
patent: 7250681 (2007-07-01), Matsunaga
patent: 7453158 (2008-11-01), Singh et al.
patent: 7465653 (2008-12-01), Huang et al.
patent: 7495343 (2009-02-01), Singh et al.
patent: 2003/0178644 (2003-09-01), Lee et al.
patent: 2003/0222354 (2003-12-01), Mastromatteo et al.
patent: 2003/0234448 (2003-12-01), Batra et al.
patent: 2003/0235018 (2003-12-01), Batra et al.
patent: 2004/0188826 (2004-09-01), Palanduz et al.
patent: 2005/0062162 (2005-03-01), Shen et al.
patent: 2005/0067709 (2005-03-01), Bachman et al.
patent: 2005/0082577 (2005-04-01), Usui
patent: 2005/0167842 (2005-08-01), Nakamura et al.
patent: 2006/0006547 (2006-01-01), Matsunaga
patent: 2006/0125118 (2006-06-01), Yamazaki
patent: 2009/0050940 (2009-02-01), Hayashi et al.
patent: 2000-58583 (2000-02-01), None
patent: 2001-085465 (2001-03-01), None
Elpida Memory Inc.
Graybill David E
Young & Thompson
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